SUMMARY:

• Electronics (box build) manufacturing environment.
• Fast - Paced Semiconductor Assembly and Test.
• SMT, through-hole and box-build manufacturing.
• Turnkey / NPI (New Product Introduction) environments.
• IPC-A-610, IPC-J-STD-001, JEDEC and MIL standards.
• Assembly process evaluation, control and validation, PPAP, FMEA, SPC, LRIP, FAI, Advanced product quality planning (APQP), Measurement Systems Analysis (MSA).
• Writing/updating Manufacturing Process Instructions, Part Specifications, Validation Protocols.
• Technical Documents: PFMEA’s, Deviation/Engineering Requests, Purge Request, Floor Issue, Component Request, QATR, NCR, SCAR, Failure Analysis, CAPA’s. High Level Product Assessments (HLPA).
• ISO 9001/02/90001 &1400 / FDA -certified electronics-
• Lean Concepts, Productivity, Continuous Improvement Tools: Fishbone Diagrams, 5S, 8D, FMEA, Process Characterization, Validation and Execution, Writing Protocols and Technical Reports, Quality Tools, Kaizen, JIT, DFMA, DFT, Process Control Methodology, Statistical Process Control, TPM, Kanban, GR&R, DOE, Control Plans, ANOVA, Test of Hypothesis, Acceptance Sampling Plans, Best Known Methods, OEE, Capacity Planning, Work Measurements, Time Studies, Inventory Control, Bottleneck Analysis
• Proven Customer Focus Team and Sales Executive experience, meeting or exceeding targets

PROFESSIONAL EXPERIENCE:

Quality Assurance Process Engineer

Confidential, Anaheim, CA

Responsibilities:

• Collaborates technical expertise with cross-functional teams: Program Managers, Product Development, Application Engineers, Software/ Firmware /Test Engineers, PCB & Mechanical Systems Design Engineers, NPI/Project Engineers, Manufacturing Engineers, Component Engineers, Failure Analysis Engineers, SMT, and Final Assembly Production and Quality teams.
• Provide engineering support to manufacturing operation on routine basis. Addresses product related issues arising on the production floor. Conducts Daily Review of Production Fallouts reported thru Production Daily Reporting. Investigates root cause of failures via scientific approaches and implement effective corrective actions.
• Work intensively with Component Engineering, QC and Manufacturing on a regular basis for issue resolution on problematic PCBAs and/or components via 8D follow-ups and process changes.
• Develop and improve manufacturing methods, systems and processes to produce a high quality product at optimal cost. Perform high-level process and system level audits for continuous improvement in quality, productivity, cycle time and yield.

Sales Manager

Confidential, Newport Beach, CA

Responsibilities:

• Supported process, yield, quality and on-time delivery improvement efforts of memory module, multimedia and storage products.
• Provided technical guidance and recommendations to IT Directors, Network Administrators and Technical Educators with the feasibility, appropriate deployment &execution of equipment upgrades and integration prior to and/or after sale.
• Supported yield improvement (pricing strategy, service negotiations, bidding) Supported revenue programs (new business, retention, contracts)

Section Manager

Confidential

Responsibilities:

• Managed a team of Section Managers (Production, Process & Maintenance) and 100+swing-shift workers in the assembly of Integrated Circuits (PDIP, SIP), SMT Packages (SSOP/SOIC/PSOP/SOJ/QFP) and Central Lead Finish Divisions
• Established sound production schedule in meeting customer demands through sound planning and coordination with support groups
• Developed, enforced and maintained standard operating procedures and product quality standards
• Continuously promoted and improved Key Performance Indices in Quality, On-time Delivery, Cycle Time, Yield and OEE at the assembly operations - Wafer Back grind, SAW, 2nd Optical, Die-Attach, Wire bond, Mold, PMC, Mark, DTFS, 4th Optical of assigned package divisions and at Central Lead Finish/Solder Plating Division
• Worked collaboratively on root cause analyses and implemented effective corrective actions via scientific approaches with cross-functional teams (Process/Quality/Equipment/PC/Customer Service/Facility/Purchasing) for sustaining requirements and continuous improvement. Made dispositions about equipment allocations, maintenance, modification and procurement
• Supported the success of Prototype Builds and/or New Product launches
• Obtained progressive promotions, periodic recognitions and special merit incentives for outstanding leadership and special assignment functions
• Reporting (imaginary) to Senior VP of Operations, designated and performed as Overall Champion for Customer Focus Teams (Plants 1 to 6) of Major Business Accounts as: Intel, Philips, Siemens/Infineon, Mitel, Motorola, RF Micro and Maxim. Led cross functional team with representatives from manufacturing, engineering, quality, customer service and logistics in providing:
• Internal & External Customer Quality Support (High-level Audit, PCN, 8D, CAR generation and follow-up)
• Support strategic customer positioning and technical alignment on manufacturing side.
• Spearheaded the remarkable improvement in Supplier Rating System (SRS) in Quality & On-Time Delivery scorecards.
• Obtained Top Supplier (Rank#1) Awards. Maintained and continuously challenged strategic leadership, collaborative team effort, proactive & consistent follow-through, technical governance & customer is #1 principles

Production Supervisor

Confidential

Responsibilities:

• Achieved target levels in key performance indices: On-time delivery, Cycle Time, Quality, Yield, TPM and Cost Effectiveness goals
• Sustained production operations in Pre-form, Manual Insertion, Wave Solder, Screen Printing (Glue/Solder Paste),
• SMT (IC & Component Mount), In-Circuit & Final test
• Performed process improvement in SMT and Wave Solder operations
• Supported continuous improvement, Design For Manufacturing projects, component design engineering for new package evaluations
• Optimized set-up for machine cycle times reductions; Line balancing

Process Engineer

Confidential

Responsibilities:

• Provided top quality process engineering sustaining support, project management, package design/development on various integrated circuit, semiconductor assemblies and other electronic components
• Key contributor in facilitating qualification of Prototype and DV builds, and production ramp ups
• Major accomplishments in achieving 100% On-time delivery, 1-4 days Turn-Around/Cycle Time, ZERO Customer Returns, 99.98% Overall Yield, 99.90% OEE and GPM goals
• Drove the ZERO Process Delay Program and 99.9% Yield teams at End-of-Line and Final Test operations (Mold, PMC, Plating, Mark, DTFS, FVI, Final Test Operations)
• Devised improvement programs which continuously promoted quality, productivity and cost effectiveness
• Performed root cause analyses via scientific approaches and implemented effective corrective actions