Senior Staff Thermal Engineer Resume

SUMMARY:

Senior mechanical engineer with PhD and extensive thermal design, testing, and CFD analysis experience at all levels of electronics: system, subsystem, board, and package.
Diverse, well - rounded thermal design experience across a wide spectrum of electronics industries including Semiconductor, Telecom, Computers and Data processing, Automotive, Consumer Electronics, PCB and Heatsink design.
Extensive familiarity with thermal management techniques used in the electronics industry.
Productive, self-starter with excellent problem solving skills and an ability to meet deadlines.
Team player with exemplary customer service skills and work ethics.

EXPERTISE AREA:

Flotherm, Icepak, Ansys Classic, Ansys Design Modeler, Minitab.
Coded and worked with Finite Difference, Finite Volume and FEA methods.
Wrote a large number of programs implementing a wide variety of numerical methods to solve engineering problems during research and coursework.
Developed a general 2-D Finite Element program to solve a general partial differential equation.
Programming in FORTRAN, C, Matlab, assembly language (Intel 8085, Motorola 6800).
Windows and Macintosh. Unix based workstations including SGI, HPUX, DEC Alpha, Solaris .

PROFESSIONAL EXPERIENCE:

Senior Staff Thermal Engineer

Confidential

Responsibilities:

Conducted extensive experiments, Finite Element (Ansys), and CFD analysis (Flotherm, Icepak) for Semiconductor products.
Developed thermal solutions for Freescale/NXP customers to prove feasibility and enable the operation of large variety of semiconductor packages in diverse industry system-level applications.
Played key role in securing many design wins for Freescale products over a wide range of customers. Provided on-site support at ZTE Networks in China.
Managed thermal lab and supervised technicians.
Tested wide range of semiconductor products for thermal performance in thermal lab.
Developed thermal models of semiconductor packages that closely agreed with experiment.
Developed and tested new semiconductor package configurations to improve thermal performance.
Developed thermal models of burn-in and test conditions.
Developed resistor network representations of packages that agreed closely with CFD simulations.
Developed several spreadsheet tools for thermal design.
Developed spreadsheet tool for initial heat sink design.
Member of the Confidential JC-15 committee to develop thermal standards in Electronics cooling.
Project monitor for Confidential research work, as part of Semiconductor Research Consortium (SRC).
Stress analysis in electrical test sockets.

Thermal Engineer

Confidential

Responsibilities:

Conducted extensive experiments and CFD analysis for server products.
Designed and conducted experimental characterization of cold plates.
Experimental characterization of fan curves.
Evaluated thermal performance of board layouts, and developed thermal solutions including:
Enhanced design of heat sinks.
Improved venting configurations.
Deployment of Confidential ’s.
Developed liquid cooling solutions in server applications for single and multi-die packages.
Developed resistor network representations of packages that agreed closely with CFD simulations.
Developed spreadsheet tools for thermal design.

Senior Consultant Engineer

Confidential

Responsibilities:

Provided consulting services in thermal analysis and design of electronics applications.
Provided technical support for the following Flomerics’ software packages:
Stress analysis package that analyzes thermal stresses in electronic packages and Confidential .
Worked closely with engineers over a wide spectrum of companies at every stage of their product design cycle.
Analysis and validation of detailed and compact package thermal models.
Technical marketing: Attended conferences and presented papers.
Responsible for software testing and validation.
Interfaced between customers and various internal departments within Flomerics including Product Development, Sales and Marketing.
Prepared and conducted general and specialized training classes for the use of CFD in electronics cooling design applications.
Constructed thermal models for application designs.
Investigated design alternatives and what-if scenarios, and recommended design improvements and modifications.
Worked on thermal design projects with engineers from major electronics